Archive

Apr 24 4:15 PM ET – Apr 25 4:15 PM ET

• —Intel reports increased demand for AI CPUs as company expands processor portfolio

Apr 23 4:15 PM ET – Apr 24 4:15 PM ET

• —Donald Trump threatens UK with tariffs over proposed digital services tax on technology companies
• —Japan's Denso to withdraw proposal to acquire Kyoto-based semiconductor manufacturer Rohm
• —Intel VP states software optimization is critical to unlocking 30% of hybrid CPU performance

Apr 22 4:15 PM ET – Apr 23 4:15 PM ET

• —TSMC debuts A13 process technology for density scaling at 2026 North America Technology Symposium
• —TSMC reports 45% March revenue increase and record Q1 profit amid Middle East supply risks
• —Meta signs multibillion-dollar deal to use Amazon general-purpose chips for AI efforts

Apr 21 4:15 PM ET – Apr 22 4:15 PM ET

• —SK Hynix reports $25.42 billion Q1 operating profit as memory prices climb
• —Intel reports $13.6B Q1 revenue as data center and AI business segments grow
• —SK Hynix reports 37.6 trillion won Q1 operating profit driven by AI memory demand

Apr 20 4:15 PM ET – Apr 21 4:15 PM ET

• —TSMC plans to open chip packaging plant in Arizona by 2029
• —TSMC introduces chip manufacturing technology to produce smaller chips without ASML High-NA EUV tools
• —Nvidia-backed Vast Data raises $1 billion in funding, tripling valuation to $30 billion

Apr 19 4:15 PM ET – Apr 20 4:15 PM ET

• —Qualcomm CEO visits South Korea to discuss Samsung foundry cooperation and memory supply
• —Applied Materials partners with Japan's Advantest to integrate front-end manufacturing and back-end testing on EPIC platform
• —AMD launches Ryzen 9 9950X3D2 processor featuring increased cache for specialized compute workloads

Apr 18 4:15 PM ET – Apr 19 4:15 PM ET

• —SK Hynix begins mass production of 192GB SOCAMM2 memory for AI servers and Nvidia platforms
• —Google expands AI hardware development to challenge Nvidia dominance in logic and compute
• —Israel's Tower Semiconductor to report Q1 2026 financial results on May 13, 2026

Apr 17 4:15 PM ET – Apr 18 4:15 PM ET

• —US businesses can claim refunds for Trump-era tariffs ruled unconstitutional starting Monday
• —Intel Nova Lake processors reportedly feature unified L2 cache and new enthusiast-focused D and DX lines
• —Micron searches for South Korean PR agency to expand DRAM market presence

Apr 16 4:15 PM ET – Apr 17 4:15 PM ET

• —Cerebras Systems files for US initial public offering as AI chip demand grows
• —IBM and Arm partner to develop infrastructure for enterprise AI and computing
• —Huawei reaches 20 per cent China smartphone market share in Q1 despite memory chip crunch

Apr 15 4:15 PM ET – Apr 16 4:15 PM ET

• —US lawmakers reportedly scale back MATCH Act restrictions on select Chinese chipmaking equipment
• —Manycore Tech pivots to robotics and AI following $150 million funding debut
• —Nvidia invests $2 billion in Arm Holdings

Apr 14 4:15 PM ET – Apr 15 4:15 PM ET

• —TSMC plans to increase capital spending and revenue forecast to meet AI chip demand
• —Intel launches Core Series 3 Wildcat Lake processors built on 18A node for value laptops
• —TSMC reports record first-quarter profit as AI demand drives chip production

Apr 13 4:15 PM ET – Apr 14 4:15 PM ET

• —ASML raises 2026 sales guidance as AI demand fuels advanced chipmaking machine orders
• —Meta expands partnership with Broadcom to develop custom AI accelerators for data centers
• —Cadence and Nvidia partner to develop artificial intelligence for robotics

Apr 12 4:15 PM ET – Apr 13 4:15 PM ET

• —Intel to buy back 49% stake in Ireland fab joint venture for $14.2B
• —Nvidia uses AI to reduce GPU design task from 80 person-months to overnight
• —Nvidia launches open-source AI models to accelerate quantum computing development

Apr 11 4:15 PM ET – Apr 12 4:15 PM ET

• —Qualcomm partners with Snap to power next-generation smart eyewear products
• —Broadcom secures deal with Google to develop Tensor Processing Units
• —Supermicro launches compact edge AI systems powered by AMD EPYC 4005 series processors

Apr 10 4:15 PM ET – Apr 11 4:15 PM ET

• —Qualcomm Snapdragon X2 Elite provides foundation for Windows on ARM ecosystem
• —NXP Semiconductors launches i.MX 93W processor for physical AI deployment
• —Japan approves $4 billion in additional subsidies for Rapidus AI chip project

Apr 9 4:15 PM ET – Apr 10 4:15 PM ET

• —Crimson Desert adds support for Intel Arc GPUs and XeSS 3.0
• —Applied Materials unveils two next-generation tools for 2nm and angstrom-scale AI chip manufacturing
• —TSMC reports 45% March revenue surge and expands global subsidiary support

Apr 8 4:15 PM ET – Apr 9 4:15 PM ET

• —US Customs to launch tariff refund tool on April 20
• —TSMC Q1 revenue reaches $35.7 billion on strong AI chip demand
• —SK Telecom, Arm, and Rebellions partner to develop AI inference server solutions

Apr 7 4:15 PM ET – Apr 8 4:15 PM ET

• —Intel, Google multiyear deal expands Xeon + custom IPUs amid CPU bottlenecks, positioning Intel to regain AI data center share
• —Qualcomm lays off dozens of senior employees in San Diego
• —Samsung Display QD-OLED monitor panel shipments surpass 5 million cumulative units

Apr 6 4:15 PM ET – Apr 7 4:15 PM ET

• —Cyient Semiconductors acquires majority stake in Kinetic Technologies for $85 million
• —Global semiconductor equipment billings reached $135 billion in 2025
• —Meta debuts Muse Spark AI model from new superintelligence group

Apr 5 4:15 PM ET – Apr 6 4:15 PM ET

• —Intel joins Elon Musk’s Terafab project to manufacture AI and robotics processors
• —Pimco weighs $14 billion debt deal for Oracle Michigan data center
• —US proposes export restrictions on ASML deep ultraviolet lithography machines to China

Apr 1 4:15 PM ET – Apr 2 4:15 PM ET

• —Chinese chip firms report record revenue as U.S. trade curbs drive domestic AI demand

Mar 30 4:15 PM ET – Mar 31 4:15 PM ET

• —Intel demonstrates AI performance for Xeon 6 and Arc Pro B70 in MLPerf Inference v6.0
• —SEMI projects double-digit growth in global 300mm fab equipment spending for 2026 and 2027
• —Denso develops next-generation silicon carbide semiconductor chips to support electric vehicle power systems