Funding & M&A
2 storiesNEXX supplies panel-level deposition equipment for AI chip packaging, according to Applied Materials' May 4 announcement. The deal expands Applied's portfolio in advanced packaging as chipmakers scale production for large-area substrates.
The deal values AMI at $1.65 billion and expands Lattice's software capabilities for chip design and embedded systems. The acquisition signals Lattice's shift toward higher-margin software and design tools to complement its FPGA and low-power semiconductor portfolio.
Executive change
1 storyKatouzian takes the newly created role of executive vice president and general manager of Client Computing & Physical AI, while Ranade assumes the chief technology officer position. The appointments signal Intel's strategic focus on strengthening its core client processor business and advancing AI-integrated computing architectures.
8 more stories
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