DailySemi

Saturday, May 23, 2026

May 22 4:15 PM ET – May 23 4:15 PM ET

Product

1 story
Huawei produces 122.88TB SSD using proprietary die-on-board packaging to bypass US sanctions

The Chinese firm mounted NAND dies directly onto PCB using wafer-level assembly, reportedly improving capacity density by 33% without relying on advanced foreign 3D NAND chips. The technology appears in Huawei's OceanStor Pacific storage systems, signaling a shift toward domestic packaging solutions to circumvent supply chain restrictions.

May 23·Tom's Hardware

Capacity & Supply

2 stories
Micron begins 1α DRAM production at Virginia fab, quadrupling DDR4 output

The Manassas expansion, backed by a $2 billion investment, targets long-lifecycle memory demand from automotive, defense, aerospace, and medical device makers. Micron is addressing unexpected DDR4 supply tightness by scaling the oldest DRAM standard on its most advanced U.S. manufacturing node.

May 23·Tom's Hardware
Nvidia CEO urges Super Micro to tighten compliance after Taiwan detains three

Taiwan authorities detained three people this week for allegedly making fraudulent declarations about AI servers supplied by Super Micro to Nvidia. The incident signals growing regulatory scrutiny of AI server supply chains and compliance practices in the region.

May 23·Bloomberg