Product
1 storyHe Tingbo, chair of Huawei's Scientist Committee, presented the new scaling law as a framework to guide chip evolution amid U.S. sanctions. The roadmap signals Huawei's push to sustain semiconductor advancement through domestic design and architecture innovation rather than reliance on advanced foreign manufacturing.
Capacity & Supply
2 storiesIntel's Rio Rancho facility in New Mexico represents a modernization of two existing fabs into an advanced packaging production site, according to NIST CHIPS program documentation. The investment signals Intel's pivot toward outsourced packaging services as demand for chiplet-based architectures and 3D integration accelerates across the industry.
The Ang Mo Kio facility spans 109,000 square feet of clean-room space and will create over 300 engineering and managerial roles, commencing operations in May 2026. Kyec targets automotive, AI, and 3C semiconductor testing demand across Southeast Asia, signaling expansion beyond Taiwan as regional demand for advanced chip validation intensifies.
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