Product
3 storiesThe complete chipset includes Gen2 Client Clock Driver (CKD02), PMIC5120, and SPD Hub supporting both CUDIMM and CSODIMM form factors. Rambus is positioning itself to supply critical memory infrastructure as AI PC adoption accelerates.
The iHBM integrates Integrated Cooling Elements into the HBM package to stabilize chip operation under high-temperature and high-pressure conditions, according to SK Hynix's May 25 announcement. The solution leverages market-proven MR-MUF technology, signaling SK Hynix's push to address thermal bottlenecks in AI accelerator design as GPU memory demands intensify.
The modules integrate 3.3 kV SiC MOSFETs and Schottky diodes in a 62 mm package and are available in production quantities now. Microchip is extending its SiC portfolio beyond earlier 3.3 kV offerings to address the growing power-conversion demands of AI infrastructure.
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